T2 Copper Plate TU1 Red Copper Strip DIY Oxygen-Free Copper Disc Laser Cutting Processing

Copper plate has good mechanical properties, good plasticity in the hot state, acceptable plasticity in the cold state, good machinability, easy soldering and welding, corrosion resistance, but prone to corrosion cracking. Additionally, it is inexpensive and widely used as a common type of copper.
Mechanical properties: Tensile strength: ≥315
Elongation: ≥30
Note: Room temperature tensile mechanical properties of other plates except those used for locks and clocks.
Sample size: Diameter >2.0~4.0
Heat treatment specifications: Hot working temperature 650~850°C; Annealing temperature 600~700°C; Low-temperature annealing temperature for stress relief 270~300°C.
Copper has the second highest electrical and thermal conductivity after silver and is widely used in the production of conductive and thermal conductive equipment. Copper exhibits good corrosion resistance in the atmosphere, seawater, certain non-oxidizing acids (hydrochloric acid, dilute sulfuric acid), alkalis, salt solutions, and various organic acids (acetic acid, citric acid), making it suitable for the chemical industry. Additionally, copper has good weldability and can be processed through cold and hot plastic deformation to produce various semi-finished and finished products. In the 1970s, copper production exceeded the total production of all other types of copper alloys.
Copper is a relatively pure form of copper, generally considered nearly pure, with good electrical conductivity and plasticity, but relatively lower strength and hardness. Copper has excellent thermal conductivity, ductility, and corrosion resistance. Trace impurities in copper significantly affect its electrical and thermal conductivity. Titanium, phosphorus, iron, and silicon notably reduce electrical conductivity, while cadmium and zinc have minimal impact. Sulfur, selenium, and tellurium have low solubility in copper and form brittle compounds, which do not greatly affect conductivity but reduce processing plasticity.